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About Me

IH
Isaac Hagedorn | @ihagedo

"Elegant hardware. Clean code. That's the goal."

I'm Isaac, a Hardware & Embedded Systems Engineer.

With a Master's in ECE from Purdue University, my research spans MRAM characterization, FPGA development, and secure microelectronics at the Birck Nanotechnology Center. I've taped out a RISC-V SoC, fabricated Magnetic Tunnel Junction arrays, and built FPGA-based testing infrastructure for memory research.

I'm passionate about bridging the gap between digital design and physical fabrication. I also hold a B.S. in Industrial Management from Purdue's Krannert School of Management, along with a Certificate in Semiconductors and Microelectronics. I speak English, Spanish, and Mandarin.

Expertise

Digital Design & FPGA
IC Design & Nanofabrication
Embedded Systems
Hardware Security
SystemVerilog / UVM
PCB Design

Education

Purdue University

West Lafayette, Indiana · Aug 2018 – May 2025

  • M.S. Electrical and Computer Engineering (2023–2025)
  • B.S. Computer Engineering (2018–2023)
  • B.S. Industrial Management — Krannert School of Management
  • Certificate in Semiconductors and Microelectronics

Tool Stack

Experience

Purdue Center for Secure Microelectronic Ecosystems

May 2023 · Present

Research Trainee

Purdue Center for Secure Microelectronic Ecosystems

Taped out RISC-V SoC with novel hardware redaction techniques in Cadence (TSMC180). Instantiated SAT Attacks to benchmark redaction security. Fabricated MTJ Arrays for MRAM sensitization and probabilistic computing at Birck Nanotechnology Center.

Purdue SoCET Research Group

Aug 2022 · Present

Graduate Research Assistant

Purdue SoCET Research Group

Translated formal verification test benches for I2C peripheral to UVM standard, improving coverage by 28%. Proposed novel MRAM sensitization method for at-risk temperature environments. Streamlined build management via FuseSoC.

Purdue University

Aug 2021 · Dec 2021

Embedded Engineer — Senior Design (RevEx)

Purdue University

Devised a non-optical wearable VR/AR controller with haptic feedback. Provided firmware for SPI, I2C, UART, ADC, PWM, DMA peripherals and an Interrupt Scheduler/Handler. Built PCB layout for data acquisition.

Jacobs Engineering / KeyW Group

May 2021 · Aug 2021

Software Engineering Intern

Jacobs Engineering / KeyW Group

Coordinated integration between two teams for a custom compression algorithm and cube satellite firmware update. Set up automated thermal/vacuum testing for PCBs. Improved REST API for satellite ground station using Yamcs.

Allegion PLC

May 2020 · Aug 2020

Firmware Engineering Intern

Allegion PLC

Developed automated repository build structure with CI, unit testing, static analysis, and Azure DevOps support. Designed automated firmware testing for Bluetooth, wireless, and UI emulation of electronic locks.

Let's Connect

If you're interested in hardware security, MRAM research, or embedded systems, feel free to check out my work on GitHub, connect on LinkedIn, or send me an email and I'll be sure to get back to you.

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© 2026 Isaac Hagedorn

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